自然科学版 英文版
自然科学版 英文版
自然科学版 英文版

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中南大学学报(英文版)

Journal of Central South University

Vol. 23    No. 10    October 2016

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Improvement of thickness deposition uniformity innickel electroforming for micro mold inserts
JIANG Bing-yan(蒋炳炎)1, 2, WENG Can(翁灿)1, 2, ZHOU Ming-yong(周明勇)1, 2, LV Hui(吕辉)1, 2, DRUMMER Dietmar3

1. State Key Laboratory of High Performance Complex Manufacturing (Central South University),Changsha 410083, China;
2. School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China;
3. Institute of Polymer Technology (Friedrich-Alexander-Universit?t Erlangen-Nürnberg),
Am weichselgarten 9, 91058 Erlangen, Tennenlohe, Germany

Abstract:Thickness deposition is a crucial issue on the application of electroformed micro mold inserts. Edge concentration effect is the main source of the non-uniformity. The techniques of adopting a non-conducting shield, a secondary electrode and a movable cathode were explored to improve the thickness deposition uniformity during the nickel electroforming process. Regarding these techniques, a micro electroforming system with a movable cathode was particularly developed. The thickness variation of a 16 mm×16 mm electroformed sample decreased respectively from 150% to 35%, 12% and 18% by these three techniques. Combining these validated methods, anickelmold insert for microlens array was electroformed with satisfactory mechanical properties and high replication precision. It could be applied to the following injection molding process.

 

Key words: deposition uniformity; nickel electroforming; secondary electrode; non-conducting shield; movable cathode; micro mold insert

中南大学学报(自然科学版)
  ISSN 1672-7207
CN 43-1426/N
ZDXZAC
中南大学学报(英文版)
  ISSN 2095-2899
CN 43-1516/TB
JCSTFT
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