自然科学版 英文版
自然科学版 英文版
自然科学版 英文版

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中南大学学报(英文版)

Journal of Central South University

Vol. 15    No. 3    June 2008

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Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate
LU Bin(卢 斌), LI Hui(栗 慧), WANG Juan-hui(王娟辉),ZHU Hua-wei(朱华伟), JIAO Xian-he(焦羡贺)

School of Materials Science and Engineering, Central South University, Changsha 410083, China

Abstract:The formation and the growth of Cu-Sn intermetallic compound (IMC) layer at the interface between Sn-3.0Ag-0.5Cu- xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is observed at the interface between solder and Cu substrate in all conditions. After aging for 120 h, the Cu3Sn IMC is then obtained. With increasing aging time, the scalloped Cu6Sn5 structure changes to a plate structure. The Cu3Sn film always forms with a relatively planar interface. By adding a small amount of the rare earth element Ce (only 0.1%, mass fraction) into the Sn-3.0Ag-0.5Cu solder alloy, the growth rate of the Cu-Sn IMC at the interface of solder alloy system is decreased. When the time exponent is approximately 0.5, the growth of the IMC layer is mainly controlled by a diffusion over the studied time range.

 

Key words: intermetallic compound; interface; Sn-3.0Ag-0.5Cu solder; rare earth element

中南大学学报(自然科学版)
  ISSN 1672-7207
CN 43-1426/N
ZDXZAC
中南大学学报(英文版)
  ISSN 2095-2899
CN 43-1516/TB
JCSTFT
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